Wire Bonding in Microelectronics, 3 Ed McGraw-Hill Professional | 2010 | ISBN: 0071476237 | 446 pages | PDF | 6,6 MB The expressed inventiveness on the critical impact of conjunctive semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This official pass covers every characteristic of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a flooded apprehension of bonding technology, you'll see how to create sure bonds at extremely high yields, test wire bonds

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